特點和優點
· 導熱系數:0.8W
· 熱阻抗:2.11℃-in2/W(@30psi)
· 墊片材料厚度:0.508mm/5.08mm
· 阻燃等級:V-O
· 連續使用溫度:-60℃+200℃
· 絕緣擊穿電壓:﹥6000V
· 柔軟、低硬度
· 提高穿刺、剪切和撕裂
· 電隔離
Gap Pad VO Soft推薦在效小壓力部件上的應用。是一個高度整合、低模量、填充硅橡膠涂覆玻璃纖維聚合物載體。
注:所得到的厚度被定義為應用程序的最終間隙厚度。

典型的應用包括
· 遠程通信
· 計算機及外圍設備
· 電源轉換
· 熱發電半導體或磁性元件與散熱片之間
· 區域熱需要轉移到車架、底盤、或其他類型的散熱器
配置可用

Property | Imperial Value | Metric Value | Test Method |
Color | Mauve/Pink | Mauve/Pink | Visual |
Reinforcement Carrier | Sil-Pad | Sil-Pad | *** |
Thickness (inch) / (mm) | 0.020 to 0.200 | 0.508 to 5.080 | ASTM D374 |
Inherent Surface Tack (1 side) | 1 | 1 | *** |
Density (Bulk Rubber) (g/cc) | 1.6 | 1.6 | ASTM D792 |
Heat Capacity (J/g-K) | 1.0 | 1.0 | ASTM E1269 |
Hardness (Bulk Rubber) (Shore 00) (1) | 25 | 25 | ASTM D2240 |
Young's Modulus (psi) / (kPa) (2) | 40 | 275 | ASTM D575 |
Continuous Use Temp. (°F) / (°C) | -76 to 392 | -60 to 200 | *** |
Electrical |
Dielectric Breakdown Voltage (Vac) | >6000 | >6000 | ASTM D149 |
Dielectric Constant (1 Mhz) | 5.5 | 5.5 | ASTM D150 |
Volume Resistivity (Ohm-meter) | 1011 | 1011 | ASTM D257 |
Flame Rating | V-O | V-O | U.L. 94 |
Thermal |
Thermal Conductivity (W/m-K) | 0.8 | 0.8 | ASTM D5470 |
Thermal Performance vs. Strain |
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Deflection (% strain) | 10 | 20 | 30 |
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Thermal Impedance (°C-in2/W) 0.040" (3) | 2.48 | 2.29 | 2.11 |
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Thermal Impedance (°C-cm2/W) 1.016mm (3) | 16.0 | 14.8 | 13.6 |
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1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
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