特點和優點
· 導熱系數：1.5W
· 熱阻抗：1.33℃-in2/W(@30psi)
· 墊片材料厚度：0.508mm-5.08mm
· 阻燃等級：V-O
· 連續使用溫度：?60℃+200℃
· 絕緣擊穿電壓：﹥6000V
· 柔軟、低硬度
· 電隔離
GapPad 1500具有理想的填料混合，給它一個低模量的特點保持最佳的熱性能，還可以很容易的處理。在材料兩側的天然粘性可以依從性好的部分相鄰的表面，最大限度地減少界面熱阻。
注：所得到的厚度被定義為應用程序的最終間隙厚度。
典型的應用包括
· 電信
· 計算機及外圍設備
· 功率轉換
· RDRAM的內存模塊/芯片級封裝
· 在熱需要傳遞到車架底盤的區域，或其他類型的散熱器
配置可用
| Property | Imperial Value | Metric Value | Test Method |
| Color | Black | Black | Visual |
| Reinforcement Carrier | *** | *** | *** |
| Thickness (inch) / (mm) | 0.020 to 0.200 | 0.508 to 5.080 | ASTM D374 |
| Inherent Surface Tack (1 sided) | 2 | 2 | *** |
| Density (Bulk Rubber) (g/cc) | 2.1 | 2.1 | ASTM D792 |
| Heat Capacity (J/g-K) | 1.0 | 1.0 | ASTM E1269 |
| Hardness (Bulk Rubber) (Shore00) (1) | 40 | 40 | ASTM D2240 |
| Young's Modulus (psi) / (kPa) (2) | 45 | 310 | ASTM D575 |
| Continuous Use Temp (°F) / (°C) | -76 to 392 | -60 to 200 | *** |
| Electrical |
| Dielectric Breakdown Voltage (Vac) | >6000 | >6000 | ASTM D149 |
| Dielectric Constant (1 Mhz) | 5.5 | 5.5 | ASTM D150 |
| Volume Resistivity (Ohm-meter) | 1011 | 1011 | ASTM D257 |
| Flame Rating | V-O | V-O | U.L. 94 |
| Thermal |
| Thermal Conductivity (W/m-K) | 1.5 | 1.5 | ASTM D5470 |
| Thermal Performance vs. Strain |
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| Deflection (% strain) | 10 | 20 | 30 |
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| Thermal Impedance (°C-in2/W) 0.040" (3) | 1.62 | 1.50 | 1.33 |
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| Thermal Impedance (°C-cm2/W) 1.016mm (3) | 10.5 | 9.7 | 8.6 |
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1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2.
3) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. |
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