點和優點
· 導熱系數：1.4W
· 墊片材料厚度：0.254mm/0.305mm
· 阻燃等級：V-O
· 連續使用溫度：-60℃+180℃
· 特殊的介電強度
· 非常低的界面電阻
· 消除機械緊固件
Bond-Ply LMS-HD導熱 熱固性層壓材料。產品 由高性能熱 導電低模量有機硅化合物 涂層在固化的核心，雙內襯 保護膜。低模量硅酮 設計有效吸收機械應力 裝配水平的CTE失配引起的沖擊和振動， 同時提供卓越的 熱性能（與PSA技術）和 長期誠信。
Bond-Ply LMS-HD將 通常被用于結構動力 秉承 組件和印刷電路板的散熱片。
典型的應用包括
· 離散半導體封裝粘結到散熱器或散熱片
配置可用
軋輥形式
切件
表格形式
保質期：粘結層lms-hd是熱固化材料，應存放在溫度控制的條件。建議儲存溫度范圍為5-25°C應該用來維持5個月保質期的最佳特性。
| Property | Imperial Value | Metric Value | Test Method |
| Color | Yellow | Yellow | Visual |
| Reinforcement Carrier | Fiberglass | Fiberglass | *** |
| Thickness (inch) / (mm) | 0.010, 0.012 | 0.254, 0.305 | ASTM D374 |
| Continuous Use Temp (°C) / (°F) | -76 to 356 | -60 to 180 | *** |
| Adhesion |
| Lap Shear @ RT (psi) / (MPa) (1) | 200 | 1.4 | ASTM D1002 |
| Electrical | Value | Test Method |
| Breakdown Voltage, Sheet (Vac) (1) | 5000 | ASTM D149 |
| Breakdown Voltage, Laminated (Vac) (2) | 4000 | ASTM D149 |
| Dielectric Constant (1000 Hz) | 5.0 | ASTM D150 |
| Volume Resistivity (Ohm-meter) | 1011 | ASTM D257 |
| Flame Rating | V-O | U.L. 94 |
| Thermal |
| Post-Cured Thermal Conductivity (W/m-K) (3) | 1.4 | ASTM D5470 |
| Thermal Performance vs Lamination Method |
| Lamination Pressure (75 psi) (4) | Constant | IPO |
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| TO-220 Thermal Performance (°C/W) | 2.1 | 2.3 |
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1) The ASTM D149 test method on cured LMS-HD material. No pressure was applied to the LMS-HD during the cure cycle.
2) A 1/2" diameter probe was laminated with LMS-HD to a 2" X 2" plate at 200 psi for 30 seconds, then cured with no pressure at 160°C for 6 minutes. The cured assembly was then tested per ASTM D149. This LMS-HD sample resembles a typical lamination application.
3) The ASTM D5470 (Henkel Modified) test procedure was used on post-cured LMS-HD material. The recorded value includes interfacial thermal resistance. These values are given for customer reference only.
4) TO-220 Thermal Performance testing, per The Henkel RD2010 specification for Laminates, was completed on laminated TO- 220 assemblies. Lamination was completed at 75 psi for 30 seconds for "IPO" (Initial Pressure Only) and at a constant 75 psi during the lamination and curing process for "Constant". No additional pressure was applied during TO-220 thermal performance testing. |
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